New Erasmus+ Partnerships in Latvia and Estonia

As part of the mobility program organized by Assoc. Prof. Dr. Derya DELİKTAŞ, Director of the Center for Coordination, Application, and Research in International Relations Director Assoc. Prof. Dr. Derya DELİKTAŞ and Deputy Director Dr. Berrin DEMİR conducted a mobility visit to Latvia and Estonia, where they held important meetings with universities and the national agency to evaluate new collaboration and internship opportunities within the framework of the Erasmus+ program.

In Latvia, discussions were held with the University of Latvia regarding the expansion of the existing Erasmus+ agreement to include different academic fields, while a meeting with the Latvian National Agency served to introduce the European Union projects currently being carried out by our university and to discuss future project partnerships and recent developments related to the Erasmus+ program.

During visits to the Riga Aeronautical Institute and Riga Technical College as part of the mobility program, international internship and study mobility opportunities were evaluated, particularly for students from our Faculty of Engineering and Vocational School. Additionally, cooperation was established to publicize the internship opportunities offered at our university’s Technopark to students at the partner institutions.

During the meetings held in Estonia, new collaboration opportunities for our Vocational School students were discussed with Tallinna Majanduskool, while an exchange of views took place with Tallinn University of Technology regarding Erasmus+ internship mobility, project collaborations, and the acceptance of international interns. Representatives from these institutions were also invited to the International Staff Week event to be organized by our university in 2027.

As a result of these visits, significant achievements were made toward strengthening our university’s international collaboration network, enhancing Erasmus+ student and staff mobility, and creating new internship opportunities.